Easy access to Digital Twins
DIGITbrain is an EU innovation program to give SMEs easy access to digital twins. Using a Digital Twin, companies can rationalise the manufacturing process, make predictions regarding expected machine failures, and can predict maintenance needs.
DIGITbrain’s second Open Call has been opened on 28th February! Proposals, that will be submitted until May 31st, 2022, 5 PM CEST, will be evaluated and considered for funding. In this Open Call, we will support 7 innovative application experiments implementing a digital twin for manufacturing in this second Open Call. Experiments will be funded with up to €97,800 per experiment (€60,000 max. per partner).
Each experiment will bring together a manufacturing end-user and technology providers to perform experimentation.
Who Can Apply?
You are eligible to apply if you belong to the following groups:
End-users, like SME or MidCap manufacturers (driving the experiments).
Technology providers, like Independent Software Vendors (ISVs), Engineering or software consultants and High-Performance Computing (HPC) providers.
Digital Innovation Hubs support you in the application process!
In order to maximise the impact of the experiments for you, each experiment will be accompanied by a Digital Innovation Hub (DIH) which will provide help from proposal writing to technical and business support for each use case. Each Digital Innovation Hub is responsible for a different region in Europe. This means, our training events will be held in six different languages: English, Italian, Hungarian, Spanish, Danish and Finnish! Feel free to simply choose the event that suits you best.
Take Part In Our Training That Will Prepare You For The Open Call
You don’t have to do everything on your own! Our Digital Innovation Hubs will not only act as your regional contact point but will provide you with personal support. They have further designed a series of events, like the Free Open Call Webinar, preparing you for the Open Call application process.
Looking for the news in another language?
Read Spanish Article by ITAINNOVA
Read German Article by cloudSME